MPC574xP Hardware
Design Guide
by: NXP Semiconductors
1 Introduction
The MPC574xP is a Power Architecture
®
based microcontroller targeting
automotive chassis and safety applications. This microcontroller features
a number of analog, communication, and safety modules, as well as two
e200z4 core complexes running in delayed lock step at up to 200 MHz.
The MPC574xP requires both 3.3 V and 1.25 V supplies. These supplies
can either both be provided externally, or the 3.3 V supply can be used to
generate the 1.25 V supply via an internal regulator and external ballast
transistor. In the simplest configuration, a single 3.3 V supply can power
the entire device.
The intention of this application note is to provide:
• Power supply requirements and the correct external circuitry required
for each supply
• Guidelines for handling injection current, including requirements for
power supply ramp rates
• Proper configuration of the external PLL circuitry
Example external interfaces for the communication and analog modules
Please note that information from the MPC574xP Reference Manual,
Datasheet, and/or Errata report may be repeated in this application note
for the convenience of the reader. The reference manual, datasheet, and
errata report are the official specification for the MPC574xP and should be
reviewed for the most up-to-date information available for this device.
2 Package Options
The MPC574xP is available in the following packages:
• 144 pin Low Profile Quad Flag Package (144 LQFP)
• 257 pin Molded Array Process Ball Grid Array (257 MAPBGA)
The table below compares the features between the two packages:
Contents
1 Introduction........................................... 1
2 Package Options................................... 1
3 Pinouts and Ball Maps.......................... 2
3.1 144 LQFP Pinout............... 3
3.2 257 MAPBGA Ball Map..... 4
4 Power Supplies......................................5
4.1 Voltage Monitoring.............7
4.2 Power-up Sequence.......... 9
4.3 Decoupling Capacitors.....10
5 Clock Circuitry..................................... 11
6 Reset.....................................................12
6.1 Reset Pins....................... 12
6.2 Boot Configuration........... 13
6.3 Pin Startup and Reset
States ................................ 14
7 Debug Connections.............................14
7.1 JTAG Interface..................15
7.2 Nexus Parallel Trace
Interface..............................15
7.3 Nexus Serial Trace
Interface..............................17
7.4 External Components.......18
8 I/O Pins................................................. 19
8.1 Unused Pin Termination.. 19
8.2 Current Injection.............. 19
9 ADC Circuitry.......................................20
10 Communication Modules..................20
10.1 Example RS232
Interface............................. 20
10.2 Example LIN Interface... 22
10.3 Example CAN Interface..24
10.4 Ethernet Interface.......... 33
10.5 Zipwire Interface............ 36
11 References......................................... 37
12 Revision history.................................37
NXP Semiconductors
Document Number: AN5267
Application Note Rev 2, 07/2017
Table 1. MPC574xP features differing by package
Feature 144 LQFP 257 MAPBGA
FlexPWM1 A[0-2]/B[0-2] A[0-3]/B[0-3]/X[0-3]/Fault[0:3]
eTimer2 ETC2-5 ETC0-5
GPIO 79 GPIO, 26 GPI 112 GPIO, 29 GPI
CTU external trigger(s) CTU0 CTU0, CTU1
ADCs
22 analog pads assigned to ADC0,
ADC1, ADC2, and ADC3
Shared channels between ADC0/
ADC1, ADC0/ADC2, and ADC1/ADC3
25 analog pads assigned to ADC0,
ADC1, ADC2, and ADC3
Shared channels between ADC0/
ADC1, ADC0/ADC2, ADC1/ADC3, and
ADC2/ADC3
SIPI/LFAST No Yes
Ethernet No Yes
Nexus Yes (MDO interface) Yes (MDO interface)
Nexus Aurora Port No Yes (TX0/TX0_P/TX1/TX1_P/CLK/
CLK_P)
The package selection should be based on the number of input/output pins required for the application and the area available
for the target system. The following table shows the size differences between the packages. Package drawings are provided
as separate documents from the NXP website. To find a package drawing, go to http://www.nxp.com and perform a keyword
search for the drawing's document number.
Table 2. Size differences between packages
Package Dimension Pitch Case Outline Document
Number
144 LQFP 20 mm x 20 mm 0.5 mm 98ASS23177W
257 MAPGBA 14 mm x 14 mm 0.8 mm 98ASA00081D
3 Pinouts and Ball Maps
Pinouts and Ball Maps
MPC574xP Hardware Design Guide, Revision 2, 07/2017
2
NXP Semiconductors