1 Introduction

The S32K series further extends the highly scalable portfolio of ARM

Cortex

MCUs in the automotive industry. It builds on the legacy of the KEA

series, whilst introducing higher memory options alongside a richer peripheral

set extending capability into a variety of automotive applications.

With a 2.70–5.5 V supply and focus on automotive environment robustness,

the S32K series devices are well suited to a wide range of applications in

electrical harsh environments. These devices are optimized for cost-sensitive

applications offering low pin-count options.

The S32K series offers a broad range of memory, peripherals, and package

options. They share common peripherals and pin counts allowing developers

to migrate easily within the MCU family or among the MCU families to take

advantage of more memory or feature integration. This scalability allows

developers to standardize on the S32K series for their end product platforms,

maximizing hardware and software reuse and reducing timeto-market.

Following are the general features of the S32K series MCUs:

• 32-bit ARM Cortex-M4 core with IEEE-754 compliant FPU, executing up

to 112 MHz

• Scalable memory footprints up to 2 MB flash and up to 256 KB SRAM

• Precision mixed-signal capability with on chip analog comparators and

multiple 12-bit ADCs

• Powerful timers for a broad range of applications including motor control,

lighting control and body applications

• Serial communication interfaces such as LPUART, LPSPI, LPI2C,

FlexCAN, CAN-FD, FlexIO and so on.

• SHE specification compliant security module

• Single power supply (2.70–5.5 V) with full functional flash program/

erase/read operations

• Functional safety compliance with ISO26262, with internal watchdog,

voltage monitors, clock monitors, memory protection and ECC

• Ambient operation temperature range: –40 °C to 125°C

• Software enablement: S32 Software Development Kit (SDK), S32 Design Studio (S32DS)

S32K family comparison

Please refer to the latest version of the Reference Manual for details.

Contents

1 Introduction..........................................1

2 S32K family comparison..................... 1

3 Power supplies.................................... 2

3.1 Bulk and decoupling

capacitors ............................... 3

4 Clock circuitry......................................3

4.1 EXTAL and XTAL pins.............3

4.2 Suggestions for the PCB

layout of oscillator circuit......... 4

5 Debug and programing interface....... 5

5.1 Debug connector pinouts........ 6

5.2 RESET system...................... 11

6 Analog comparator interface............ 11

7 Communication modules.................. 13

7.1 LIN interface for LPUART

module...................................13

7.2 CAN interface for FlexCAN

module...................................17

7.3 Inter-Integrated Circuit IIC......20

7.4 Ethernet MAC Interface......... 22

8 Quad Serial Peripheral Interface...... 23

9 Unused pins....................................... 26

10 General board layout guidelines.... 27

10.1 Traces recommendations....27

10.2 Grounding .......................... 27

10.3 EMI/EMC and ESD

considerations for layout....... 28

11 PCB layer stacking...........................30

12 Injection current...............................31

13 References........................................31

14 Revision history............................... 31

AN5426

Hardware Design Guidelines for S32K1xx Microcontrollers

Rev. 3 — December 2018

Application Note

3 Power supplies

The power and ground pins are described in subsequent sections.

Figure 1. Power supply pins

Table 1. Power domains and decoupling capacitors

Power

Domain

Descripti

Voltage

Bulk/Bypass Capacitor for domain Decoupli

Capacito

per pin

Characte

ristics

Package

176

LQFP

144

LQFP

100

LQFP/

BGA

64 LQFP 48 LQFP/

QFN

32 LQFP/

QFN

VDDX

Supply

voltage

5 V/3.3 V 10uF 10uF 10uF 10uF 10uF 10uF 0.1uF X7R

Ceramic

VDDA

Analog

supply

voltage

10uF 10uF 10uF 0.1uF X7R

Ceramic

VREFH

ADC

reference

voltage

high

0.1uF X7R

Ceramic

VSS

Ground GND VSS, VSSA and VREFL must be shorted to GND at package level.

Table continues on the next page...

NXP Semiconductors

Power supplies

Hardware Design Guidelines for S32K1xx Microcontrollers , Rev. 3, December 2018

Application Note

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