± 2g / 4g / 8g Tri-axis Digital

Accelerometer Specifications

PART NUMBER:

KX122-1037

Rev. 6.0

15-Jan-2018

tel: 607-257-1080 – fax: 607-257-1146 728-10535-1801111600-0.38

www.kionix.com - info@kionix.com Page 1 of 83

Product Description

The KX122-1037 is a tri-axis ±2g, ±4g or ±8g silicon micromachined

accelerometer with integrated 2048-byte buffer, orientation,

Directional-Tap

/Double-Tap

, activity detecting, and Free fall

algorithms. The sense element is fabricated using Kionix’s proprietary

plasma micromachining process technology. Acceleration sensing is

based on the principle of a differential capacitance arising from

acceleration-induced motion of the sense element, which further

utilizes common mode cancellation to decrease errors from process

variation, temperature, and environmental stress. The sense element

is hermetically sealed at the wafer level by bonding a second silicon lid

wafer to the device using a glass frit. A separate ASIC device packaged with the sense element provides

signal conditioning, and intelligent user-programmable application algorithms. The accelerometer is

delivered in a 2 x 2 x 0.9 mm LGA plastic package operating from a 1.71V – 3.6V DC supply. Voltage

regulators are used to maintain constant internal operating voltages over the range of input supply

voltages. This results in stable operating characteristics over the range of input supply voltages. I

C or

SPI digital protocol is used to communicate with the chip to configure and check for updates to the

orientation, Directional-Tap

/Double-Tap

detection, Free fall detection, and activity monitoring

algorithms.

Features

• 2 x 2 x 0.9 mm LGA

• User-selectable g Range up to ±8g

• User-selectable Output Data Rate up to 25600Hz

• User-selectable Low Power or High Resolution modes

• Digital High-Pass Filter Outputs

• Extra-large embedded 2048 byte FIFO/FILO buffer

• Low Power Consumption with FlexSet™ Performance Optimization

• Internal voltage regulator

• Enhanced integrated Free fall, Directional-Tap

/Double-Tap

, and Device-orientation Algorithms

• User-configurable wake-up function

• Digital I

C up to 3.4MHz and Digital SPI up to 10MHz

• Lead-free Solderability

• Excellent Temperature Performance

• High Shock Survivability

• Factory Programmed Offset and Sensitivity

• Self-test Function

± 2g / 4g / 8g Tri-axis Digital

Accelerometer Specifications

PART NUMBER:

KX122-1037

Rev. 6.0

15-Jan-2018

tel: 607-257-1080 – fax: 607-257-1146 728-10535-1801111600-0.38

www.kionix.com - info@kionix.com Page 2 of 83

Table of Contents

PRODUCT DESCRIPTION .................................................................................................................................................................... 1

FEATURES ......................................................................................................................................................................................... 1

TABLE OF CONTENTS ......................................................................................................................................................................... 2

FUNCTIONAL DIAGRAM .................................................................................................................................................................... 5

PRODUCT SPECIFICATIONS ................................................................................................................................................................ 6

MECHANICAL ............................................................................................................................................................................................ 6

ELECTRICAL ............................................................................................................................................................................................... 7

Start Up Time Profile ........................................................................................................................................................................ 8

Current Profile .................................................................................................................................................................................. 8

Power-On Procedure ......................................................................................................................................................................... 9

ENVIRONMENTAL ..................................................................................................................................................................................... 10

TERMINOLOGY ........................................................................................................................................................................................ 11

g ...................................................................................................................................................................................................... 11

Sensitivity ........................................................................................................................................................................................ 11

Zero-g offset ................................................................................................................................................................................... 11

Self-test ........................................................................................................................................................................................... 11

FUNCTIONALITY ....................................................................................................................................................................................... 12

Sense element ................................................................................................................................................................................. 12

ASIC interface ................................................................................................................................................................................. 12

Factory calibration .......................................................................................................................................................................... 12

APPLICATION SCHEMATIC AND PIN DESCRIPTION ........................................................................................................................................... 13

Application Schematic .................................................................................................................................................................... 13

Pin Description ................................................................................................................................................................................ 13

PACKAGE DIMENSIONS AND ORIENTATION ................................................................................................................................................... 14

Dimensions ..................................................................................................................................................................................... 14

Orientation ..................................................................................................................................................................................... 15

DIGITAL INTERFACE ......................................................................................................................................................................... 17

C SERIAL INTERFACE ............................................................................................................................................................................... 17

C Operation .................................................................................................................................................................................. 18

Writing to an 8-bit Register ............................................................................................................................................................ 19

Reading from an 8-bit Register ....................................................................................................................................................... 20

Data Transfer Sequences ................................................................................................................................................................ 21

HS-mode ......................................................................................................................................................................................... 22

C Timing Diagram ......................................................................................................................................................................... 23

SPI COMMUNICATIONS............................................................................................................................................................................. 24

4-Wire SPI Interface ........................................................................................................................................................................ 24

4-Wire SPI Timing Diagram ............................................................................................................................................................ 25

4-Wire Read and Write Registers ................................................................................................................................................... 26