Disclaimer:
This process guide is provided to users of ceramic/PTFE laminates and fastRise™ to assist in gaining an
understanding of these materials and to quickly establish processes for PCB fabrication. It is assumed that the
users will have a technical understanding and experience in the processes, equipment and standards related to
PCB fabrication. The user will likely need to make adjustments to account for specific requirements and their
production processes.
Ceramic/PTFE Laminates with fastRise
TM
TSM-DS
TSM-DS3
RF-35A2
RF-35TC
RF-60TC
RF-10
Processing Guide
July 2016
TABLE OF CONTENTS
GENERAL INFORMATION 3
CERAMIC/PTFE LAMINATES 3
FASTRISE
TM
PREPREGS 3
STORAGE 3
CERAMIC/PTFE LAMINATES 3
FASTRISE
TM
3
HANDLING 4
CERAMIC/PTFE LAMINATES 4
FASTRISE
TM
B-STAGE 5
INNER LAYER PREPARATION 5
ACCLIMATION 5
SCALING 5
LAMINATION 6
QUICK START 6
FLOW PATTERN / THIEVING 7
PADDING AND CONFORMANCE MATERIALS 7
PRESSURE 7
TEMPERATURE 8
FOIL LAMINATION 10
ADDITIONAL NOTES 11
DRILLING 13
QUICK START 13
DRILL BITS 13
CHIP LOAD 14
CUTTING SPEED 14
DWELL TIME 14
PECK DRILLING 14
HIT COUNT 15
ENTRY / BACKER MATERIALS 15
LASER DRILLING / MICROVIAS 15
HOLE WALL PREPARATION 16
DESMEAR 16
PTFE ACTIVATION 16
PROCESS EXAMPLE 17
PLATING 18
IMAGE, DEVELOP, ETCH, STRIP 18
SOLDER MASK 18
OVERVIEW 18
PATTERN PLATED COPPER 19
PANEL PLATED COPPER 20
SOLDER REFLOW 20
ROUTING / MILLING 21
The following process recommendations are based on testing and production processes at several circuit board facilities. Each facility
will have different product designs, equipment, or methods that will require modifications to these recommendations. For example,
drilling parameters, routing parameters, and artwork compensation can vary dependent on circuit board thickness, design, processes,
and equipment. Adjustments should be based on the experience of each facility. Please contact your Taconic representative if
assistance is required.