RO3000

and RO3200

™

Series High Frequency Laminates

STRIPLINE AND MULTILAYER CIRCUITS

Advanced Connectivity Solutions

100 S. Roosevelt Avenue, Chandler, AZ 85226

Tel: 480-961-1382, Fax: 480-961-4533 www.rogerscorp.com

MATERIAL DESCRIPTION:

RO3003™, RO3006™ and RO3010™ copper clad laminates are ﬁ lled PTFE composites offering excellent

thermal reliability and electrical performance over a range of dielectric constants. RO3000

series materials

provide the homogeneity of properties that are expected of unreinforced materials. RO3203™, RO3206™,

and RO3210™ copper clad laminates are woven glass reinforced versions that provide similar thermal and

electrical characteristics while offering the improved ease of handling and registration control that are

associated with glass reinforced laminates. RO3000 and RO3200™ series products are compatible with

manufacturing processes for double-sided and multilayer circuits using PTFE materials.

These guidelines were developed to provide fabricators with basic information on processing double-sided

and multi-layer boards using copper clad RO3000 and RO3200 series laminates. A Rogers' technical service

engineer or sales representative should be contacted for more detailed processing information.

STORAGE:

RO3000 and RO3200 cores can be stored indeﬁ nitely at ambient conditions. A ﬁ rst-in-ﬁ rst-out (FIFO)

inventory system is recommended as is a method of record keeping that would allow tracking of material lot

numbers through PWB proc-essing and delivery of ﬁ nished circuits.

Storage in Original Shipping Cartons

1) Stack cartons on a ﬂ at surface that is safely out of the way of mobile handling and moving

equipment. Cartons may be stored on their side if nothing heavy is stacked on top.

2) Cartons should be stacked to a maximum of ﬁ ve high to avoid excessive weight on the bottom

packages.

Storage of Panels Removed from Cartons

1) Thin panels should remain sealed within the polyethylene bags and the adherent polyethylene sheets

should remain on thicker cores. These packaging materials deter oxidation and corrosion of the

metal layers and provide a measure of protection against mechanical damage (e.g. scratches, pits,

dents, etc.). For RO3000 laminates with thick copper plates, the thick metal plate is not protected

by anti-tarnish layers. As such, some discoloration due to oxidation is expected during storage,

especially under conditions of elevated temperature and humidity. The oxidation can be removed

Fabrication Notes

Page 2 of 8

Advanced Connectivity Solutions

100 S. Roosevelt Avenue, Chandler, AZ 85226

Tel: 480-961-1382, Fax: 480-961-4533 www.rogerscorp.com

by mechanical (debur) or chemical exposure (microetch) which are standard to the PCB fabrication

process.

2) Store panels on edge in slotted shelving units keeping the clad surfaces vertical. This provides easy

access with low risk of damage to the metal surfaces.

3) If storage facilities do not permit vertical stacking:

A) The shelf must be ﬂ at, smooth, and clean.

B) The shelf must extend beyond the full area of the panels being stored.

C) Surfaces of the laminates must be free of debris.

D) Shelf loading should be kept below 50 pounds per square foot.

E) Panels should be interleaved with soft, non-abrasive separator sheets.

HANDLING:

PTFE-based materials are softer than most other rigid printed wiring board laminates and are more

susceptible to handling damage. Cores clad only with copper foils are easily creased. Materials bonded

to thick aluminum, brass, or copper plates are more prone to scratches, pits, and dents. Proper handling

procedures should be followed.

1) Wear gloves of knit nylon or other non-absorbent material when handling panels. Normal skin oils

are slightly acidic and readily corrode copper surfaces. Fingerprints are difﬁ cult to remove as normal

brighteners will dissolve the corrosion, but leave corrosive oils in the copper to cause the ﬁ ngerprint

to reappear hours or days later. The following procedure is recommended to remove ﬁ ngerprints:

A) Bright dip in dilute hydrochloric acid.

B) Degrease in acetone, methyl ethyl ketone, or vapor degrease with chlorinated solvents.

C) Water rinse and bake dry for 60 minutes @ 250°F (125°C).

D) Repeat bright dip.

2) Keep work surfaces clean, dry, and completely free of debris.

3) Leave the polyethylene bag or sheet in place through initial processes such as shearing, sawing,

blanking, and punching.

4) Only pick panels by two edges. Thin cores in particular lack the stiffness required to support

themselves by one edge or corner, handling them in that manner may dimensionally distort the

dielectric or impart a permanent crease.

5) During processing, cores should be transported between workstations on ﬂ at carrying trays,

preferably interleaved with a soft, sulfur-free paper. Vertical racks should not be used unless they

are slotted and provide adequate vertical support.

INNER LAYER PREPARATION:

Tooling: RO3000 and RO3200 materials are compatible with many tooling systems. Choosing whether to

use round or slotted pins, external or internal pinning, standard or multiline tooling, and pre vs. post-etch

punching would depend upon the capabilities and preferences of the circuit facility and the ﬁ nal registration

requirements. In general, slotted pins, a multiline tooling format, and post-etch punching will meet most

needs. Whichever approach is used, it is good practice to retain copper around tooling holes.