Chemical content PESD15VL2BT
Type number Package Package description Total product weight
PESD15VL2BT SOT23 TO-236AB 7.97553 mg
Pb-free soldering Pb soldering
12NC Effective Version MSL PPT MPPT MSL PPT MPPT Number of
processing
cycles
Assembly site RHF-
indicator
9340 588 66215 2017-01-11 12 1 260 30 s 1 235 20 s 3 Seremban, Malaysia
Subpart Material
group
Substances CAS number Mass(mg) Mass(%) of subpart Mass(%) of total product
Die Doped silicon Silicon (Si) 7440-21-3 0.28000 100.00000 3.51074
subTotal 0.28000 100.00000 3.51074
Lead Frame Iron-nickel alloy Aluminium (Al) 7429-90-5 0.00221 0.09000 0.02765
Carbon (C) 7440-44-0 0.00098 0.04000 0.01229
Chromium (Cr) 7440-47-3 0.00515 0.21000 0.06451
Cobalt (Co) 7440-48-4 0.01029 0.42000 0.12902
Iron (Fe) 7439-89-6 1.15836 47.28000 14.52393
Manganese (Mn) 7439-96-5 0.02083 0.85000 0.26111
Misc. Phosphor compounds
(generic)
7723-14-0 0.00049 0.02000 0.00614
Misc. Sulfur compounds
(generic)
7704-34-9 0.00049 0.02000 0.00614
Nickel (Ni) - cas no. 7440-02-0 7440-02-0 0.87245 35.61000 10.93903
Silicon (Si) 7440-21-3 0.00613 0.25000 0.07680
Pure metal layer Copper (Cu) 7440-50-8 0.32169 13.13000 4.03340
Silver (Ag) 7440-22-4 0.05096 2.08000 0.63896
subTotal 2.45000 100.00000 30.71898
Mould Compound Filler Silica fused 60676-86-0 3.55000 71.00000 44.51117
Pigment Carbon black 1333-86-4 0.01500 0.30000 0.18808
Polymer Epichlorohydrin/o-
Cresol/Formaldehyde polymer
(generic)
29690-82-2 0.98500 19.70000 12.35028
Phenolic resin Proprietary 0.45000 9.00000 5.64226
subTotal 5.00000 100.00000 62.69179
Post-plating Impurity Antimony (Sb) 7440-36-0 0.00001 0.00300 0.00008
Bismuth (Bi) 7440-69-9 0.00000 0.00100 0.00003
Copper (Cu) 7440-50-8 0.00000 0.00100 0.00003
Lead (Pb) 7439-92-1 0.00001 0.00500 0.00013
Tin solder Tin (Sn) 7440-31-5 0.20998 99.99000 2.63279
subTotal 0.21000 100.00000 2.63306
Wire Impurity Non hazardous Proprietary 0.00000 0.01000 0.00005
Pure metal Gold (Au) 7440-57-5 0.03552 99.99000 0.44539
subTotal 0.03553 100.00000 0.44544