Chemical content BAS321
Type number Package Package description Total product weight
BAS321 SOD323 SOD2 4.15831 mg
Pb-free soldering Pb soldering
12NC Effective Version MSL PPT MPPT MSL PPT MPPT Number of
processing
cycles
Assembly site RHF-
indicator
9340 553 52115 2017-07-07 13 1 260 30 s 1 235 20 s 3 Dongguan, China
9340 553 52135 2017-07-07 9 1 260 30 s 1 235 20 s 3 Dongguan, China
9340 553 52145 2016-04-28 1 1 260 30 s 1 235 20 s 3 Dongguan, China
Subpart Material
group
Substances CAS number Mass(mg) Mass(%) of subpart Mass(%) of total product
Die Doped silicon Silicon (Si) 7440-21-3 0.06000 100.00000 1.44289
subTotal 0.06000 100.00000 1.44289
Lead Frame Copper alloy Copper (Cu) 7440-50-8 1.21651 95.04000 29.25493
Iron (Fe) 7439-89-6 0.03264 2.55000 0.78493
Lead (Pb) 7439-92-1 0.00038 0.03000 0.00924
Misc. Phosphor compounds
(generic)
7723-14-0 0.00192 0.15000 0.04617
Zinc (Zn) 7440-66-6 0.00256 0.20000 0.06156
Pure metal layer Silver (Ag) 7440-22-4 0.02598 2.03000 0.62487
subTotal 1.28000 100.00000 30.78171
Mould Compound Filler Silica fused 60676-86-0 2.01373 75.10000 48.42670
Pigment Carbon black 1333-86-4 0.00804 0.30000 0.19345
Polymer Epichlorohydrin/o-
Cresol/Formaldehyde polymer
(generic)
29690-82-2 0.46925 17.50000 11.28452
Phenol Formaldehyde resin
(generic)
9003-35-4 0.19038 7.10000 4.57829
subTotal 2.68140 100.00000 64.48296
Post-plating Impurity Antimony (Sb) 7440-36-0 0.00001 0.01000 0.00032
Bismuth (Bi) 7440-69-9 0.00003 0.02000 0.00064
Iron (Fe) 7439-89-6 0.00001 0.01000 0.00032
Lead (Pb) 7439-92-1 0.00001 0.01000 0.00032
Tin solder Tin (Sn) 7440-31-5 0.13327 99.95000 3.20484
subTotal 0.13333 100.00000 3.20644
Wire Pure metal Copper (Cu) 7440-50-8 0.00358 100.00000 0.08600
subTotal 0.00358 100.00000 0.08600
Note(s):
1) This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the
closest match available.
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