General Processin g Guidelines
NF-30
Table of Contents
General Information ……………………………………………………………………… 3
Storage ...…………….……………………………….…………………………………… 3
Handling …………….…………………………….………………………………………. 4
Design consideration ……………………………………………………………………... 5
Inner layer Preparation…………………………………………………………………… 6
Drilling …………���……………………………….……………………………………….. 7
Hole wall Preparation……………………………………………………………………… 9
Plating………………………………………………………………………………………. 10
Image, Develop, Etch, Strip………………………………………………………………. 10
Solder Mask………………………………………………………………………………… 10
ROUTING/MILLING……………………………………………………………………….. 11