Disclaimer:
This process guide is provided to users fastRise™ to assist in gaining an understanding of these materials and to
quickly establish processes for PCB fabrication. It is assumed that the users will have a technical understanding
and experience in the processes, equipment and standards related to PCB fabrication. The user will likely need to
make adjustments to account for specific requirements and their production processes.
fastRise™
Processing Guide
August 2017
TABLE OF CONTENTS
GENERAL INFORMATION 3
OVERVIEW 3
FASTRISE™ STANDARD PREPREGS 3
FASTRISE™ SPECIALTY PREPREGS 3
FASTRISE™ S PREPREGS 4
FASTRISE™ 7 PREPREGS 4
STORAGE 5
HANDLING 5
INNER LAYER PREPARATION 6
LAMINATION 6
QUICK START 6
PADDING AND CONFORMANCE MATERIALS 7
PRESSURE 7
TEMPERATURE 9
FOIL LAMINATION 10
ADDITIONAL NOTES 11
DRILLING 13
QUICK START 13
DRILL BITS 14
CHIP LOAD 14
CUTTING SPEED 14
DWELL TIME 14
PECK DRILLING 14
HIT COUNT 15
ENTRY / BACKER MATERIALS 15
LASER DRILLING / MICROVIAS 16
HOLE WALL PREPARATION 16
DESMEAR 16
PTFE ACTIVATION 17
PROCESS EXAMPLE 17
PLATING 18
IMAGE, DEVELOP, ETCH, STRIP 18
SOLDER MASK 18
SOLDER REFLOW 18
ROUTING / MILLING 18
The following process recommendations are based on testing and production processes at several circuit board facilities. Each facility
will have different product designs, equipment, or methods that will require modifications to these recommendations. For example,
drilling parameters, routing parameters, and artwork compensation can vary dependent on circuit board thickness, design, processes,
and equipment.
Adjustments should be based on the experience of each facility. Please contact your Taconic representative if assistance is required.