Revision: December, 2012 www.wontop.com
Material Composition Declaration
Package Information
Package Package Weight (mg) Terminal Finish MSL Rating
SOT-363 6 Matte Tin (Sn) 1
Produc
t Group
Type No. Description
RB731XN Diode Schottky 30mA 40V
SD103ATW Diode Schottky 175mA 40V
BAT54ADW / CDW / SDW Diode Schottky 200mA 30V
BAT54BRW, BAT54TW Diode Schottky 200mA 30V
BAS16TW, BAV70DW, BAV99BRW, BAV756DW Diode Switching 150mA 75V
BAW56DW, BAW567DW, MMBD4148TW Diode Switching 150mA 75V
BAV99DW Diode Switching 215mA 75V
BAV199DW Diode Switching 215mA 85V
MMBD4448DW Diode Switching 250mA 75V
MMBD4448HADW / HCDW / HSDW Diode Switching 250mA 80V
MMBD4448HAQW / HCQW Diode Switching 250mA 80V
MMBD4448HTW Diode Switching 250mA 80V
Component Material Substance CAS No.
Material
Mass
(%)
Material
Mass
(mg)
Component
Mass
(%)
Component
Mass
(mg)
PPM
Die Doped Silicon* Si 7440-21-3 100.00 0.184 3.07 0.184 30667
Wire Bond Gold Au 7440-57-5 100.00 0.019 0.32 0.019 3167
Fe 7439-89-6 56.40 1.337 222874
Ni 7440-02-0 42.00 0.996 165970
Mn 7439-96-5 0.80 0.019 3161
Co 7440-48-4 0.50 0.012 1976
Leadframe Ferrous Alloy
Si 7440-21-3 0.30 0.007
39.52 2.371
1186
Ag 7440-22-4 80.00 0.053 8800
Bisphenol F 28064-14-4 15.00 0.010 1650
Die Bond Silver Silicone
Glycidyl
neodeconate
26761-45-5 5.00
0.003
1.10 0.066
550
Plating Matte Tin Sn 7440-31-5 100.00 0.194 3.23 0.194 32333
Silica 7631-86-9 79.00 2.501 416857
Epoxy Resin 29690-82-2 20.00 0.633 105533
Encapsulation EMC
Carbon Black 1333-86-4 1.00 0.032
52.76 3.166
5277
Tolerance ±10%
*Dopant and metallization of the silicon die are not reported in this statement where their concentration is less than the minimum report
able
level per EIA JIG-101.
Data disclosed herewith is approximate and is based on information from suppliers surveys, Material Safety Datasheet, engineering
calculations and measurements. Won-Top Electronics(WTE) has checked all information carefully and believes it to be correct and accurate.
However, WTE cannot assume any responsibility for inaccuracies. WTE reserves the right to change any or all information herein without
further notice.
WON-TOP ELECTRONICS
®
Revision: December, 2012 www.wontop.com
RoHS Declaration
The European Parliament and of the Council on the Restriction of the use of Certain Hazardous Substances in Electrical and Electronics
Equipment (RoHS) directive restricts the concentration of Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr6+), P olybrominated Biphenyls
(PBB), Polybrominated Diphenyl Ethers (PBD) to 0.1%(1000 PPM) and restricts the concentration of Cadmium (Cd) to 0.01%(100 PPM) in
homogeneous materials of electronics products.
The product group listed above and the homogenous materials are compliant with the Directive 2011/65/EU. WTE warrants that all its packing,
components and/or products supplied to the Customer and/or its affiliated companies or designated contractors do not contain these
hazardous substances in quantity levels higher than or equal to the thresholds to this directive.
Exemptions as declared for the directive are:
7(a) Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).
7(c)-I Lead in glass (applicable for glass passivated silicon die).