GOF2000 Thermal Gasket Thermally Conductive Gasket w/ Silicone Foam

PublishTime：2021-09-24

Laird’s Graphite-over-Foam (GOF), GOF2000 thermal gasket, provides thermal transfer performance in the form of a traditional wrapped compressible foam gasket. GOF2000 combines the thermal transfer performance of the Tgon™ 9000 synthetic graphite outside wrap and the repeatable compression and rebound of a foam core. GOF2000 utilizes Laird LSF series silicone foam allowing for a UL V0 flammability rating.
●FEATURES AND BENEFITS
■ Efficient thermal transfer over large gaps
■ High Deflection
■ Repeatable compression and rebound cycles
■ Lightweight
■ Low force thermal interface
■ Abrasion resistant exterior
■ Ease of manufacturing for high volume
■ No bleed from silicone oil or other materials
■ High operating temperature suitability and UL VO flammability rating
●VALUE
■ Provides compressible thermal interface for sliding connections. Ideal for insertioi applications.
■ Ensures thermal interface contact in high movement locations that would separat traditional thermal putty, gel, or grease
■ Offers lower force than traditional thermal gap pads for pressure sensitive applica
■ Ideal thermal performance for large gap sizes
■ Improved reliability performance of electronics
■ RoHS and REACH compliant

Brand of Product：	Laird
Part#：	GOF2000 Thermal Gasket More Part#
Product Category：	Thermally Conductive Gasket w/ Silicone Foam More
Application：	More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2021/09/02
Version Number：
Data Encoding：
Data Size：	994 KB

Data section preview(2pages)

- The full preview is over. If you want to read the whole 3 page document,please Sign in/Register -

Download

+1 Like
Add to Favorites

Recommend

New Products & Solutions

More>

Technical Resources

More>

All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.

Integrated Circuits