TAZ SERIES CWR09 - MIL-PRF-55365/4 Established Reliability, COTS-Plus & Space Level
2021-08-04
●This is the original high reliability molded tantalum chip series and the case sizes still represent the most flexible of surface mount form factors. TAZ offers nine case sizes, eight of which (A through H) are fully qualified to MILPRF-55365/4, and also includes the original sub-miniature R case (non-QPL).
●This series is fully interchangeable with CWR06 conformal types, while offering the advantages of molded body/compliant termination construction (ensuring no TCE mismatch with any substrate). This construction is compatible with a wide range of SMT board assembly processes including convection reflow solder, conductive epoxy or compression bonding techniques.
●The parts also carry full polarity and capacitance/voltage marking. The five smaller cases are characterized by their low profile construction, with the A case being the world's smallest molded military tantalum chip.
●All 4V to 50V ratings are qualified to MIL-PRF-55365 Weibull“B”,“C”,“D”and“T”levels, with all surge options (“A",“B”&“C”) available.For Space Level applications, AVX SRC 9000 qualification is recommended (see ratings table for part number availability).
There are four termination finishes available: solder plated, fused solder plated, hot solder dipped and gold plated (these are“H”, “K”,“C”and“B”termination, respectively, per MIL-PRF-55365). In addition, the molding compound has been selected to meet the requirements of UL94V-0 (Flame Retardancy) and outgassing requirements of ASTM E-595.
●For moisture sensitivity levels please refer to the High Reliability Tantalum MSL section located in the back of the High Reliability Tantalum Catalog.
●This series is fully interchangeable with CWR06 conformal types, while offering the advantages of molded body/compliant termination construction (ensuring no TCE mismatch with any substrate). This construction is compatible with a wide range of SMT board assembly processes including convection reflow solder, conductive epoxy or compression bonding techniques.
●The parts also carry full polarity and capacitance/voltage marking. The five smaller cases are characterized by their low profile construction, with the A case being the world's smallest molded military tantalum chip.
●All 4V to 50V ratings are qualified to MIL-PRF-55365 Weibull“B”,“C”,“D”and“T”levels, with all surge options (“A",“B”&“C”) available.For Space Level applications, AVX SRC 9000 qualification is recommended (see ratings table for part number availability).
There are four termination finishes available: solder plated, fused solder plated, hot solder dipped and gold plated (these are“H”, “K”,“C”and“B”termination, respectively, per MIL-PRF-55365). In addition, the molding compound has been selected to meet the requirements of UL94V-0 (Flame Retardancy) and outgassing requirements of ASTM E-595.
●For moisture sensitivity levels please refer to the High Reliability Tantalum MSL section located in the back of the High Reliability Tantalum Catalog.
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