THERMAL MANAGEMENT FOR BGAs PRELIMINARY PRODUCT DATA SHEET
a high performance bond in the assembly of EBGA (Enhanced Ball Grid Array) and TBGA (Tape Ball Grid Array) semiconductor packages. Their thermally conductive filler ensures superior package performance when used to bond the flex or laminate substrate to stiffeners and heat spreaders.
In addition to offering excellent adhesive and thermal
characteristics, these compliant materials absorb mismatches in CTE (coefficient of thermal expansion) of
various package materials. They have been formulated to be ionically clean in order to eliminate concern over corrosion on the substrate or on plated stiffeners and heat spreaders.
THERMATTACH BGA assembly tapes are designed
and tested to meet the rigorous performance demands
of the semiconductor packaging industry, including HAST (Highly Accelerated Stress Test) and PCT (Pressure Cooker Testing).
Supplied in rolls or on reels, THERMATTACH Tapes can
be die-cut to component dimensions.
THERMFLOW phase-change materials are specially
formulated for use in high performance devices requiring
minimum thermal resistance for maximum component
reliability. For over 30 years grease has been employed as the interface between a flip chip die and the heat spreader or lid. With the advent of THERMFLOW products, phasechange materials are finding their way into“inside the
package”applications to replace thermal grease.
A major advantage of using THERMFLOW materials is
their ability to be pre-applied. Moreover, they eliminate the concerns of thermal cycling “pump-out” which can accompany the use of thermal grease.
At room temperature, THERMFLOW materials are solid
and easy to handle, for clean application equivalent to
installing conventional dry thermal interface pads. At
device operating temperatures, however, THERMFLOW materials soften and flow, conforming readily to both surfaces and filling microscopic air pockets and surface imperfections.
THERMFLOW materials are supplied die-cut on rolls.
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T421 、 T422 、 T424 、 T427 、 T443 、 T725 、 THERMFLOW™ T443 、 THERMFLOW™ T725 、 THERMFLOW™ T421 、 THERMFLOW™ T422 、 THERMFLOW™ T424 、 THERMFLOW™ T427 |
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Phase-Change Interface Pads for BGA 、 Thermally Conductive BGA Assembly Tapes |
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Datasheet |
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Please see the document for details |
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100AG-242 |
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