Thermal Interface Materials For Electronics Cooling Products & Custom Solutions Catalog

2020-12-24

Chomerics, a division of Parker Hannifin Corporation (NYSE:PH), is a global provider of EMI shielding, thermal interface materials, plastics and optical products. Chomerics specializes in providing products and services to OEM and CEM electronics companies in the telecommunications, information technology, consumer, power conversion, medical device, defense, and transportation markets. Since 1961, Chomerics has been a leader in the development of electrically conductive elastomers for use as extruded, molded and form-in-place EMI gaskets for telecommunications and electronics applications. Chomerics also offers an extensive family of thermal interface materials, which transfer heat from electronic components to heat sinks. Careful management of thermal interfaces is crucial to maintaining the reliability and extending the life of electronic devices and equipment. As each new electronic product generation requires higher power in smaller packages, the challenges associated with thermal management become more intense.
Thermal material drivers include:
● Lower thermal impedance.
● Higher thermal conductivity.
● Greater compliance and conformability.
● High reliability.
● Greater adhesion.
● Ease of handling, application and use.
● Long service life.
Chomerics has a successful history of providing thermal materials expertise and commitment to developing new, high performance products to meet the thermal challenges of systems designers.
Chomerics products have been designed into thousands of applications and help assure the performance, integrity, survivability and maintainability of communications equipment, radar, aircraft, computers, control systems, telecommunications, consumer devices, automotive and industrial electronics. Our customers are supported with comprehensive applications engineering, supply chain and fabrication services worldwide.

Parker Chomerics

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Thermal Interface MaterialsThermally conductive gap filler padsFully cured dispensable thermal gelsSilicone-free thermal padsPhase-change materials (PCM)Polymer solder hybrids (PSH)Dispensable thermal compoundsThermal greaseDielectric padsThin flexible heat spreadersCustom integrated thermal/EMI assembliesConductive elastomersConductive foam based gasketsfabric-over-foamz-axis foamConductive compoundsadhesivessealantscaulksRF absorbing materialsEMI shielding plasticsCoatingsdirect metallization and conductive paintsMetal gasketsSpringfingersmetal meshcombination gasketsFoil laminatesconductive tapesEMI shielding ventscommercial and military honeycomb ventsShielded optical windowsCable shieldingferrites and heat-shrink tubingwire mesh tapezippered cable shieldingEMI shielding filters (conductive coating & wire mesh)Anti-reflective/contrast enhancement filtersPlastic or glass laminationsHard coated lens protectorsTouchscreen lenseselectrically-conductive plasticsTraditional thermoplastics

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telecommunications ]information technology ]consumer ]power conversion ]medical device ]defense ]transportation markets ]communications equipment ]radar ]aircraft ]computers ]control systems ]consumer devices automotive industrial electronics ]

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TO-3;TO-66

English Chinese Chinese and English Japanese

May 2014

CAT 1002 EN

10.1 MB

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